Title:
【発明の名称】冷却およびエアコンディショニングにおける使用のための金属表面のプラズマ重合による改良
Document Type and Number:
Japanese Patent JP3426583
Kind Code:
B2
Abstract:
According to the present invention, there is provided a plasma polymerization surface modification of a metal for enhancing its applicability for use in refrigerating and air conditioning such as in constructing heat exchanges, by using a DC discharge plasma, comprising the steps of: (a) positioning an anode electrode which is substantially of metal to be surface-modified and a cathode electrode in a chamber, (b) maintaining a pressure in the chamber at a predetermined vacuum level, (c) blowing a reaction gas composed of an unsaturated aliphatic hydrocarbon monomer gas or fluorine-containing monomer and silicon containing monomer gas at a predetermined pressure and a non-polymerizable gas at a predetermined pressure into the chamber, and (d) applying a voltage to the electrodes in order to obtain a DC discharge, whereby to obtain a plasma consisting of positive and negative ions and radicals generated from the unsaturated aliphatic hydrocarbon monomer gas and the non-polymerizable gas, and then forming a polymer with hydrophilicity or hydrophobicity on the surface of the anode electrode by plasma deposition, and there is also provided a plasma polymerization surface modification of a metal for enhancing its applicability for use in refrigerating and air conditioning such as in constructing heat exchanges, by using an RF plasma.
Inventors:
Suk-kun
Hyun Jin, Jun
Choi, Wong Cork
Kung, Byunha
Kim, kihwan
Ha, sam tulle
Kim, Cheol Hwan
Choi, Sun-Chan
Hyun Jin, Jun
Choi, Wong Cork
Kung, Byunha
Kim, kihwan
Ha, sam tulle
Kim, Cheol Hwan
Choi, Sun-Chan
Application Number:
JP2000523400A
Publication Date:
July 14, 2003
Filing Date:
December 03, 1998
Export Citation:
Assignee:
Korea Institute of Science and Technology
LG Electronics Co., Ltd.
LG Electronics Co., Ltd.
International Classes:
B05D7/24; C08F2/00; C23C16/44; C08G83/00; C23C14/12; C23C14/22; C23C16/30; C23C16/50; C23C16/503; C23C16/515; C23C16/56; F28F13/18; B05D3/14; B05D5/08; F25B47/00; (IPC1-7): C23C16/50; C08F2/00; C08G83/00; F28F13/18
Domestic Patent References:
| JP215169A | ||||
| JP224884A | ||||
| JP345894A | ||||
| JP4329638A | ||||
| JP5179034A | ||||
| JP6207923A | ||||
| JP857414A | ||||
| JP9133494A | ||||
| JP5734518A | ||||
| JP61213221A | ||||
| JP5503876A | ||||
| JP7504943A |
Other References:
【文献】米国特許4526806(US,A)
Attorney, Agent or Firm:
Takashi Ishida (4 others)