Title:
【発明の名称】可撓性基板をチップにボンディングする方法
Document Type and Number:
Japanese Patent JPH10513610
Kind Code:
A
Abstract:
Method for thermally bonding contact elements (14, 15) of a flexible film substrate (10) to contact metallizations (17) of an electronic component (12), the flexible film substrate having a support layer (13) of transparent plastics material and energy being applied to the contact elements from their rear by means of laser radiation (11), the transparency of the support layer (13), the absorption of the contact elements (14, 15) and the wavelength of the laser radiation (11) being matched to one another in such a way that the laser radiation is essentially transmitted through the support layer (13) and absorbed in the contact elements (14, 15), and the pressure being applied to the substrate (10) in such a way that the contact elements (14, 15) of the substrate (10) and the contact metallizations (17) of the component (12) are up against one another during the application of the laser radiation (11) in the region of an application point of the optical fibre.
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Inventors:
Asdash, Gassen
Zaquel, Elk
Reich, Herbert
Zaquel, Elk
Reich, Herbert
Application Number:
JP52457796A
Publication Date:
December 22, 1998
Filing Date:
February 14, 1996
Export Citation:
Assignee:
Fraunhofer-Geselle Shaft Tool Forderung Del Angewanten Forschung A. Far.
International Classes:
B23K26/00; B23K20/10; H01L21/60; H01L21/603; H05K3/32; H05K1/18; (IPC1-7): H01L21/60; B23K26/00; H01L21/603
Attorney, Agent or Firm:
Yasuo Ishikawa