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Patent Searching and Data


Title:
DETACHING DEVICE FOR WATER-CURABLE INORGANIC MOLDING
Document Type and Number:
Japanese Patent JPH09290415
Kind Code:
A
Abstract:

To provide a detaching device for securely transferring a molding to a receiving molding die without damaging by installing a vibrator for causing the vibration of a suction face.

After a molding process, a suction face 1a is set to the top force face 30a of a molding die for a molding W remaining in the bottom force 31 of the die, and the air in a cavity 3 is vacuum-decompressed by a vacuum pump through piping 4, and further, the molding W is caused to fit to the suction face 1a by vacuum suction by sucking the air from a small hole 1b. In addition, a detaching device 1 is transferred to a receiving molding die 33, then the molding W is laid along the contour of the receiving face of the die 33, and a vibrator 2 is activated top give a vibration to the suction face 1a. At the same time, the vacuum suction operation of the vacuum pump is suspended, then instead, a pressurizing pump is activated to feed the pressurized air into the cavity 3 through the piping 4, and thereby, the cavity 3 is internally pressurized with the air. Consequently, the pressurized air is blown to the suction face 1a side from the small hole 1b to force the molding W to be released from the molding die and the molding W is transferred to the receiving molding die 33.


Inventors:
NASU ATSUSHI
SUSUKI HIDEMASA
Application Number:
JP10733896A
Publication Date:
November 11, 1997
Filing Date:
April 26, 1996
Export Citation:
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Assignee:
SEKISUI CHEMICAL CO LTD
OKAYAMA SEKISUI KOGYO KK
International Classes:
B66C1/02; B28B1/24; B28B13/06; (IPC1-7): B28B13/06; B28B1/24; B66C1/02