Title:
検知モジュール及び電子装置
Document Type and Number:
Japanese Patent JP7417662
Kind Code:
B2
Abstract:
A sensing module and an electronic device are provided. The sensing module includes a substrate, at least one light-emitting unit, a light-guiding assembly, at least one sensing circuit structure, and a sensing processor. The light-guiding assembly is connected to the substrate and includes at least one light-guiding structure. The at least one light-emitting unit is configured to emit a light beam outwardly through the at least one light-guiding structure. One end of the at least one sensing circuit structure is disposed on the substrate. The sensing processor is disposed on the substrate, and is configured to sense a capacitance change in a peripheral area of the at least one sensing circuit structure by the at least one sensing circuit structure and to generate a sensing signal. The sensing processor or an external controller is configured to control the at least one light-emitting unit according to the sensing signal.
Inventors:
郭 ▲ゆー▼甫
What Wenbin
What Wenbin
Application Number:
JP2022084557A
Publication Date:
January 18, 2024
Filing Date:
May 24, 2022
Export Citation:
Assignee:
Hi Go Technology Fun Co., Ltd.
International Classes:
G06F3/02; H01H9/16; H01H36/00; H03K17/955; H05K5/00
Domestic Patent References:
| JP2017162464A | ||||
| JP2016039067A | ||||
| JP2006090032A | ||||
| JP2017004793A | ||||
| JP2009134618A | ||||
| JP2006236774A |
Foreign References:
| WO2009020069A1 | ||||
| US20060089732 |
Attorney, Agent or Firm:
Patent Attorney Corporation ASFI International Patent Office