Title:
DEVICE CHIP MANUFACTURING METHOD
Document Type and Number:
Japanese Patent JP2022100502
Kind Code:
A
Abstract:
To provide a manufacturing method of a high quality device chip without a damage like a crack.SOLUTION: A device chip manufacturing method which divides a wafer 1 to manufacture each device chip includes: a preparation step which prepares a cutting device having a chuck table, which can hold the wafer 1, and a cutting unit having a rotatable cutting blade 34 which can cut the wafer 1 held on the chuck table; a wafer holding step which holds the wafer 1 with the chuck table; a half-cut groove formation step which cuts the wafer 1 with the cutting blade 34 along a first division scheduled line to form a half-cut groove 13; a first full-cut step which cuts the wafer 1 with the cutting blade along a second division scheduled line to form a first division groove; and a second full-cut step which cuts the wafer 1 with the cutting blade 34 along the first division scheduled line to form a second division groove and thus to form each device chip.SELECTED DRAWING: Figure 4
Inventors:
NAKANO TSUTOMU
Application Number:
JP2020214512A
Publication Date:
July 06, 2022
Filing Date:
December 24, 2020
Export Citation:
Assignee:
DISCO ABRASIVE SYSTEMS LTD
International Classes:
H01L21/301
Attorney, Agent or Firm:
Matsumoto
Tomohiro Okamoto
Takahiro Kasahara
Hideaki Okamoto
Takayuki Okano
Toshikazu Imato
Tomohiro Okamoto
Takahiro Kasahara
Hideaki Okamoto
Takayuki Okano
Toshikazu Imato