Title:
METHOD FOR MANUFACTURING DEVICE CHIP
Document Type and Number:
Japanese Patent JP2023091896
Kind Code:
A
Abstract:
To prevent chip defects when manufactured device chips are stacked and thermocompression bonded.SOLUTION: A method for manufacturing a device chip for manufacturing a device chip that divides workpiece having a surface and a rear face, in which the surface is divided by a plurality of crossing division schedule lines, and devices are provided each of divided regions on the surface, and manufactures a device chip includes: a processing groove formation step of processing the workpiece along the division schedule line, and forming a processing groove; a resin layer formation step of forming a resin layer on the surface side of the workpiece, after the processing groove formation step; and a resin layer division step of dividing the resin layer along the division schedule line of the workpiece, after the resin layer formation step. Preferably, the method further includes a tape sticking step of sticking a tape onto the rear face side of the workpiece, before the resin layer division step, and the resin layer division step expands the tape stuck onto the rear face side of the workpiece, and thereby divides the resin layer.SELECTED DRAWING: Figure 9
Inventors:
OGAWA YUKI
WATABE KOJI
HASHIMOTO KAZUTERU
AOYAGI HAJIME
WATABE KOJI
HASHIMOTO KAZUTERU
AOYAGI HAJIME
Application Number:
JP2021206750A
Publication Date:
July 03, 2023
Filing Date:
December 21, 2021
Export Citation:
Assignee:
DISCO ABRASIVE SYSTEMS LTD
International Classes:
H01L21/301
Attorney, Agent or Firm:
Akira Matsumoto
Tomohiro Okamoto
Takahiro Kasahara
Hideaki Okamoto
Takayuki Okano
Toshikazu Imato
Tomohiro Okamoto
Takahiro Kasahara
Hideaki Okamoto
Takayuki Okano
Toshikazu Imato