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Title:
DEVICE FOR CLEANING SOLDER PRINTING MASK, SOLDER PRINTING MACHINE, AND METHOD FOR CLEANING THE SOLDER PRINTING MASK
Document Type and Number:
Japanese Patent JP2011093214
Kind Code:
A
Abstract:

To provide a device for cleaning a solder printing mask, capable of sufficiently cleaning the lower surface of the solder printing mask even when a paper member pressing part rides on the projected part of the lower surface of the mask, a solder printing machine, and a method for cleaning the solder printing mask.

In one of a pair of paper member pressing parts 22 having its lower end fixed to a nozzle part 21 moved relative to a mask 4 to extend upward, and disposed facing the relative moving direction of the nozzle part 21 to the mask 4 to press a paper member 24 to the lower surface of the mask 4, a notched part 22k is provided, through which a projected part 4b formed in the lower surface of the mask 4 can pass when the nozzle part 21 is moved relative to the mask 4 in a state where the pair of paper member pressing parts 22 are brought into contact with the lower surface of the mask 4.


Inventors:
TANAKA TETSUYA
Application Number:
JP2009249764A
Publication Date:
May 12, 2011
Filing Date:
October 30, 2009
Export Citation:
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Assignee:
PANASONIC CORP
International Classes:
B41F35/00; B41F15/08; B41F15/12
Domestic Patent References:
JPS61164895A1986-07-25
JPH06122190A1994-05-06
JPH08153962A1996-06-11
Attorney, Agent or Firm:
Hiroki Naito
Daisuke Nagano
Kentaro Fujii