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Title:
材料パネルを穿孔するためのデバイス
Document Type and Number:
Japanese Patent JP7034100
Kind Code:
B2
Abstract:
An apparatus for perforating a panel of material comprising a driver assembly; a perforation assembly comprising a cutting edge for cutting the panel of material; an impacting surface moveable with respect to the cutting edge; and, means for holding the panel of material in a material plane between the cutting edge and the impacting surface, wherein the driver assembly is arranged to drive the cutting edge through the material plane into the impacting surface to cut the panel of material.

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Inventors:
Takashi Yamaguchi
Choda, Bar
Application Number:
JP2018564366A
Publication Date:
March 11, 2022
Filing Date:
June 09, 2017
Export Citation:
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Assignee:
Aston Martin Lagonda Limited
International Classes:
B26F1/02; B26D5/16; B26D7/08; B26D7/18; B26D7/20; D05B11/00; D05B37/02
Domestic Patent References:
JP57081098U
JP63028597A
JP2009544475A
JP2002239992A
JP11172565A
JP52000785U
Foreign References:
WO2015076389A1
DE19541129C1
US2405598
DE3614106A1
US3730634
Attorney, Agent or Firm:
Ryoichi Takaoka
Nao Oda
Akiyo Iwahori
Kamoto Takahashi