Title:
DEVICE FOR HARDENING LIQUID THERMOSETTING RESIN
Document Type and Number:
Japanese Patent JP3281547
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a device of hardening liquid thermosetting resin in a structure for accelerating hardening from the thermosetting resin on the lower side to be a lenticular surface.
SOLUTION: In this hardening device for forming the lenticular surface of a light emitting element 33 by installing a mold case 5, filled with the liquid thermosetting resin 35 as a light emitting element 33 attached to a lead frame 31 remains inserted, inside a curing oven in the state of being mounted on the case receiving part 21 of a base plate 6, supplying hot air inside the curing oven and hardening the liquid resin, an opening part 28 is formed in the case receiving part 21 of the base plate 6, and the hot air is supplied through the opening 28 to the bottom surface part of the mold case 5 mounted on the case receiving part 21.
Inventors:
Hiroki Oda
Masahiro Konishi
Masahiro Konishi
Application Number:
JP22209196A
Publication Date:
May 13, 2002
Filing Date:
August 23, 1996
Export Citation:
Assignee:
Sharp Corporation
International Classes:
B29C35/04; B29C39/10; B29C39/38; B29D11/00; H01L21/56; B29K101/10; B29K105/24; B29L11/00; (IPC1-7): H01L21/56; B29C35/04; B29C39/10; B29C39/38; B29D11/00
Domestic Patent References:
| JP6134985A | ||||
| JP6232191A | ||||
| JP533549U |
Attorney, Agent or Firm:
Yoshiro Kurauchi
Previous Patent: UNDERWATER CURABLE RESIN COMPOSITION
Next Patent: POWDERY COMPOSITION FOR WATERPROOF BONDING MATERIAL USED FOR CONCRETE STRUCTURE
Next Patent: POWDERY COMPOSITION FOR WATERPROOF BONDING MATERIAL USED FOR CONCRETE STRUCTURE