Title:
DEVICE FOR MANUFACTURING FORMING RAIL
Document Type and Number:
Japanese Patent JP2669261
Kind Code:
B2
Abstract:
PURPOSE: To provide a manufacturing device for forming rail by a load at the time of bending of a metallic plate is reduced and an adhesive bending is performed with inexpensive material.
CONSTITUTION: Just before the adhesive bending is performed on the heated part 6 of the metallic plate with a top part die 2 and a side part die 3, only the outer side part of the adhesive bending part 1f, 1g is locally heated by a laser beam 4. Consequently, the adhesive bending part of the metallic plate is made easy to deform, and even an inexpensive material may be bent with a low load and without causing hair cracks, etc.
Inventors:
Takenobu Honda
Application Number:
JP10442892A
Publication Date:
October 27, 1997
Filing Date:
April 23, 1992
Export Citation:
Assignee:
Mitsubishi Electric Corporation
International Classes:
B21D5/06; B21D5/08; B21D11/20; B21D47/01; B21D53/00; B23K26/352; B66B7/02; B66B19/00; (IPC1-7): B21D5/08; B21D53/00; B23K26/00; B66B7/02
Domestic Patent References:
| JP57142722A |
Attorney, Agent or Firm:
Kaneo Miyata (3 outside)
Previous Patent: JP2669260
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