Title:
DEVICE MANUFACTURING METHOD, PIEZOELECTRIC DEVICE MANUFACTURING METHOD, AND ELECTRODE PAD MANUFACTURING METHOD
Document Type and Number:
Japanese Patent JP2019145732
Kind Code:
A
Abstract:
To manufacture a device while guaranteeing good bond strength in wire bonding, and reducing man-hours.SOLUTION: A device manufacturing method includes a removal process (S11-S14) for removing a second electrode layer 122 from a layer structure member 15, where the second electrode layer 122 is provided while sandwiching a piezoelectric layer 121 between a first electrode layer 112 and the second electrode layer, while leaving a device part 12 and an electrode pad 13 separated from the device part 12, and an electrification process (S15-S17) for electrifying a first electrode layer 112 and the second electrode layer 122 in the electrode pad 13.SELECTED DRAWING: Figure 2
Inventors:
SAKUMA NOBORU
TAKAHASHI HIROKAZU
YAMAOKA NOBUKI
TAKAHASHI HIROKAZU
YAMAOKA NOBUKI
Application Number:
JP2018030534A
Publication Date:
August 29, 2019
Filing Date:
February 23, 2018
Export Citation:
Assignee:
PIONEER ELECTRONIC CORP
International Classes:
H01L41/29; H01L41/09; H01L41/332; H02N2/00; H04R31/00
Attorney, Agent or Firm:
Fumio Takino
Toshiaki Tsuda
Yasuhiro Fukuda
Toshiaki Tsuda
Yasuhiro Fukuda