To provide a device for measuring the thickness of a doubling sliver, capable of solving the problem in the measurement of the thickness of the doubling sliver by a conventional technique, markedly improving the understanding of the change in the thickness of the sliver and guiding the sliver more accurately.

This device can measure the thickness of slivers by inserting the slivers 5a to 5n entering on a plane to narrow parts constituted of plural movable touch-sensing members and facing members facing thereto, and allowing the position changes of the touch-sensing members to act on a converter for generating control pulses, and has the touch-sensing members constituted of plural touch-sensing elements 30a to 30n regulated so that the thicknesses of passing slivers 5a to 5n may displace the touch-sensing elements 30a to 30n respectively, and the displacements may be added.