To provide a pattern adjusting device which sticks a desired amount of a composition for adjustment by a single defect-revision work even in the case of using only one adjusting needle.

The pattern adjusting device which is provided with a sharp adjusting needle, and a moving means for relatively moving the adjusting needle, and which can make a composition for adjustment adhere to the tip of the adjusting needle and stick the composition for adjustment adhering to the tip to a defective point in a minute pattern formed of an organic or inorganic material, is added with a temperature control means for controlling the temperature of the composition for adjustment in the vicinity of the tip of the adjusting needle.