Title:
DEVICE AND METHOD FOR CONTROLLING MIXING RATIO, AND SYSTEM AND METHOD FOR SUPPLYING ABRASIVE LIQUID
Document Type and Number:
Japanese Patent JP2015077682
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To use two kinds of stock solution tanks storing stock solution with different dilution ratio from each other in a common abrasive liquid supply device.SOLUTION: An abrasive liquid supply device 10 includes: a stock solution supply part 12 for supplying abrasive liquid stock solution from a stock solution tank T to a mixing tank 11; a diluting fluid supply part 13 for supplying diluting fluid to the mixing tank 11 through a diluting fluid flow passage 13a; and a control part 15 for controlling the stock solution supply part 12 and the diluting fluid supply part 13 so that abrasive liquid generated by mixing the abrasive liquid stock solution and the diluting fluid at prescribed ratio is generated in the mixing tank. A mixing ratio control device 30 includes: a discharge part 31 for discharging the diluting fluid flowing in the diluting fluid flow passage 13a at an upstream side of the mixing tank 11; and a discharge control part 32 for controlling the discharge part 31 so that when a prescribed kind of the stock solution tank is used, and when control described above is performed, the abrasive liquid stock solution and the diluting fluid are mixed at ratio different from the prescribed ratio.
Inventors:
BABA HIROYUKI
TOSHIKAWA KIYOHIKO
TOSHIKAWA KIYOHIKO
Application Number:
JP2014239657A
Publication Date:
April 23, 2015
Filing Date:
November 27, 2014
Export Citation:
Assignee:
LAPIS SEMICONDUCTOR CO LTD
International Classes:
B24B57/02; B24B37/00; H01L21/304
Domestic Patent References:
| JPH10175166A | 1998-06-30 |
Attorney, Agent or Firm:
Minoru Maeda
Youichi Yamagata
Masahiko Shinohara
Youichi Yamagata
Masahiko Shinohara