Title:
DEVICE AND METHOD OF FORMING LIQUID-TIGHT JOINT BETWEEN TWO ELEMENT
Document Type and Number:
Japanese Patent JPS63172066
Kind Code:
A
Abstract:
A device and a method for forming at least a liquid tight joint between two elements. Either or both elements have sealing portions, which in an area intended for abutment of the elements provide said joint when said elements are brought together in the abutment area. The sealing portion is formed as a seal which by being formed by sequential injection moulding technique is molecularly integral with an area directly adjacent to said seal. The injection moulding technique allows a choice of a relatively softer material for the sealing portion and a high degree of design freedom, including designs of high hygiene standards, especially well suited for aseptic or sterile packaging systems.
Inventors:
MAGUNUSU BERUGUSUTOROOMU
PERUUSUTEFUAN GERUSUBURO
YAN OROFU FURANSON
PERUUSUTEFUAN GERUSUBURO
YAN OROFU FURANSON
Application Number:
JP31311587A
Publication Date:
July 15, 1988
Filing Date:
December 10, 1987
Export Citation:
Assignee:
AKERLUND & RAUSING AB
International Classes:
B65D30/24; F16J15/10; F16J15/00; F16J15/32; F16L17/06; F16L47/02; (IPC1-7): F16J15/10
Attorney, Agent or Firm:
Akira Asamura (3 outside)