Title:
DEVICE AND METHOD FOR GRINDING SEMICONDUCTOR WAFER
Document Type and Number:
Japanese Patent JP3150933
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To achieve high levels of flatness and parallelism for the height of a wafer surface by applying a specified pressure to at least one of a plurality of pressure chambers prior to grinding of a semiconductor wafer and transmitting a grinding pressure during grinding to the backside of a supporting plate via the elastic support surface of the pressure applied pressure chamber.
SOLUTION: The side of a grinding head 2 facing the supporting plate 1 of a grinding machine has opening channels 3 disposed parallel and coaxial to the circumference of the supporting plate 1. In each opening channel 3, a pressure chamber, for instance a bellows or a soft tube made of an elastic material having special low rigidity is positioned. When a pressure is applied to the pressure chamber 4 by filling the same with gas or liquid, the support surface 5 of the pressure chamber 4 facing the supporting plate 1 is press- contacted with the backside 6 of the supporting plate 1. Thus, a pressure difference caused by a position difference made by the non-uniformity or elastic deformation of the backside of the supporting plate 1 is compensated by the pressure chamber 4.
Inventors:
Paul Mueller
Thomas Bushhard
Heinrich Hengfer
Norbert Zickman
Reiner Neumann
Franz Mangs
Manfeld Toulner
Claus Rutger
Thomas Bushhard
Heinrich Hengfer
Norbert Zickman
Reiner Neumann
Franz Mangs
Manfeld Toulner
Claus Rutger
Application Number:
JP33894397A
Publication Date:
March 26, 2001
Filing Date:
December 09, 1997
Export Citation:
Assignee:
Wacker Ziltronique Gezelshaft Fuer Halbreiter Materia Lien Akchen Gezelshaft
International Classes:
B24B37/04; B24B37/30; B24B41/047; B24B49/16; B25J15/06; H01L21/304; (IPC1-7): B24B37/00; H01L21/304
Domestic Patent References:
| JP7122523A | ||||
| JP9193003A | ||||
| JP62165849U |
Attorney, Agent or Firm:
Tadashi Hagino (3 outside)