To provide a device for mounting electronic components that is compact and has improved mounting efficiency, and a method for mounting the electronic components.

In a packaging device of electronic components for picking up electronic components and mounting them on a substrate by a transfer head from a supply part for supplying the electronic components, a traveling means for relatively moving a transfer head 6 between each tape feeder 5 and the mounting position of the substrate is composed of a head travel mechanism for moving the transfer head 6 horizontally in the X and Y directions, and a cylinder 13 for horizontally moving a feeder base 12, where a plurality of tape feeders 5 are arranged in one piece. In this way, stroke of a head traveling mechanism for moving the transfer head in X and Y directions is reduced, miniaturizing the device, and at the same time, improving the mounting efficiency.