Title:
DEVICE AND METHOD FOR MOUNTING PART
Document Type and Number:
Japanese Patent JP2000223887
Kind Code:
A
Abstract:
To improve the productivity of a circuit board by efficiently exchanging parts supply units.
When parts exchange is made in the event of a program change, only the cassettes which are not used in the next production are slidably pulled out and housed in the slots 15 of a wagon 14 following a second straight guide. A wagon loaded with parts cassettes 11 to be exchanged is brought to the front of a parts mounting device 500 and only the parts cassettes to be used are successively set on a supply base by sliding. After the parts cassettes to be used are set on the supply base, the wagon is separated from the device 500 and production is started.
Inventors:
OKUDA OSAMU
KABESHITA AKIRA
MORI KAZUO
KABESHITA AKIRA
MORI KAZUO
Application Number:
JP2724199A
Publication Date:
August 11, 2000
Filing Date:
February 04, 1999
Export Citation:
Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
H05K13/02; (IPC1-7): H05K13/02
Attorney, Agent or Firm:
Aoyama Ryo (2 outside people)
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