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Patent Searching and Data


Title:
DEVICE FOR MOLDING MOLDABLE MATERIAL AND MOLDING OF THE MATERIAL
Document Type and Number:
Japanese Patent JPH1075758
Kind Code:
A
Abstract:

To provide a device for molding a food, capable of decreasing the damage to the moldable material to increase a production capacity, and to provide a method for molding the food.

This molding device is provided with a feeding manifold 44 for receiving a moldable material and with plungers or pistons for adding a pressure to the moldable material in the manifold. A mold plate 24 having mold holes 26 is driven between a charging position and a releasing position. A clamp member 200 is placed at a position adjacent to the mold plate 24 placed at the charging position. A pressure is added to the clamp member 200 to press the mold plate 24 to the feeding manifold 44. The clamp member 200 and a structure cooperated together therewith surely press the mold plate 24 to the feeding manifold 44. The structure enables to utilize the mold plate 24 having a relatively thin cross-section and the clamp member 200 similarly having a relatively thin cross-section to realize the molding device having a remarkably increased width. The employment of a mold plate knife assembly to charge and cut the moldable material facilitates to mold the accurate part of the moldable material.


Inventors:
LONDON EUGENE JACK
Application Number:
JP12780197A
Publication Date:
March 24, 1998
Filing Date:
May 02, 1997
Export Citation:
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Assignee:
STEIN INC
International Classes:
A21C11/00; A21C11/16; A21C11/18; A22C7/00; A21D6/00; A23P1/00; A23P1/10; (IPC1-7): A23P1/10; A21C11/16; A23P1/00
Attorney, Agent or Firm:
Sanada Yuzo (2 outside)