Title:
DEVICE FOR STICKING FILM ON LEAD FRAME AND ITS FILM STICKING METHOD
Document Type and Number:
Japanese Patent JP3003758
Kind Code:
B2
Abstract:
PURPOSE: To reduce the generation of a film punching flash by making a clearance between a punch and a die larger in a part to punch a convex part than in a part to punch a straight line part.
CONSTITUTION: A punch 19 and a die 20 are adjusted so that the clearance at C1 is 10% of the thickness of a film and the clearance at C2 is 100% to 130% of the clearance at Cq. That is, in the case where a film having a plurality of convex parts is punched, the clearance at C1 having a straight line of not less than 1mm is minimized and the clearance at C2 in the convex part is maximized. Thereby, the generation of a film punching flash can be greatly reduced.
Inventors:
Toshio Kawamura
Kenichi Kaneko
Toshikatsu Hiroe
Noboru Imai
Hiroyuki Kousaka
Kenichi Kaneko
Toshikatsu Hiroe
Noboru Imai
Hiroyuki Kousaka
Application Number:
JP33928793A
Publication Date:
January 31, 2000
Filing Date:
December 03, 1993
Export Citation:
Assignee:
Hitachi Cable Ltd.
International Classes:
H01L23/50; (IPC1-7): H01L23/50
Domestic Patent References:
| JP61179559A | ||||
| JP62110897U |
Attorney, Agent or Firm:
Tadao Hirata (1 outside)