Title:
DEVICE USING LEAD FREE SOLDER
Document Type and Number:
Japanese Patent JP2005138171
Kind Code:
A
Abstract:
To prevent stainless steel from being corroded by arsenic (As) which is an impurity in lead-free solder.
In a device intended to use lead-free solder and composed of a metallic material (SUS-stainless steel-material) that is corroded by lead-free solder 8, a nickel layer 11 is provided to the surface of the metallic material that is corroded by the lead-free solder.
Inventors:
KATSUKI KENJI
OTA HIROYUKI
SHIKAME HIROMASA
AIZAWA TOSHIE
OTA HIROYUKI
SHIKAME HIROMASA
AIZAWA TOSHIE
Application Number:
JP2003380062A
Publication Date:
June 02, 2005
Filing Date:
November 10, 2003
Export Citation:
Assignee:
TOSHIBA CORP
International Classes:
B23K3/06; B23K1/08; H05K3/34; (IPC1-7): B23K1/08; B23K3/06; H05K3/34
Attorney, Agent or Firm:
Yoshiaki Inomata
Osamu Kikuchi
Hiroko Inomata
Osamu Kikuchi
Hiroko Inomata
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