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Title:
POLISHING/LAPPING DEVICE
Document Type and Number:
Japanese Patent JPH01216767
Kind Code:
A
Abstract:

PURPOSE: To enable the continuous feeding, and the continuous taking out after polishing/lapping, of workpieces by installing a spiral guide on one of disk-like upper and lower boards and providing a workpiece throw-in hole on the upper board while providing a workpiece take-out bole on the lower board.

CONSTITUTION: Out of upper and lower boards 1, 3 which are relatively rotated in the opposite directions, a workpiece throw-in hole 2 is provided in the vicinity of the center or periphery of the upper board 1 while providing a workpiece take-out hole 5 in the vicinity of the periphery or center of the lower board 3. A workpiece 5 is thrown in from this throw-in hole 2 between the upper and lower boards 1 and 3 to be subjected to polishing/lapping machining by means of the upper and lower boards 1, 3 which are rotated in the mutually opposite directions. Then, the workpiece 5 is moved in the outer periphery direction or the center direction being guided by a spiral guide 4 installed on the lower board 3. Thereby, the polished/lapped workpieces 5 are continuously taken out of the workpiece take-out hole 6 and fed to a carry out passage 8.


Inventors:
KISHII SADAHIRO
Application Number:
JP4194688A
Publication Date:
August 30, 1989
Filing Date:
February 26, 1988
Export Citation:
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Assignee:
FUJITSU LTD
International Classes:
B24B7/04; B24B37/08; (IPC1-7): B24B7/04; B24B37/04
Domestic Patent References:
JP62068761B
JPS5458296A1979-05-10
Attorney, Agent or Firm:
Seiichi Samukawa