To provide a diallyl phthalate resin molding material which exhibits improved resistance to solder reflow and excellent moldability while keeping its excellence in electrical properties, mechanical properties, etc., regardless of the type of a diallyl phthalate resin.

The diallyl phthalate resin molding material is obtained by using a curing catalyst consisting of 2,5-dimethyl-2,5-bis(benzoylperoxy)hexane or by using a curing catalyst consisting of dicumyl peroxide and 2,5-dimethyl-2,5-bis(benzoylperoxy)hexane. The 2,5-dimethyl-2,5-bis(benzoylperoxy)hexane is used in an amount of desirably 0.05 to 1.0 wt.% based on the whole molding material. The dicumyl peroxide is used in an amount of desirably 0.1 to 0.7 wt.% based on the whole molding material.