Title:
DIAMINE FOR FORMING LOW DIELECTRIC CONSTANT RESIN, COMPOSITION, POLYIMIDE, LOW DIELECTRIC MEMBER, AND ELECTRONIC EQUIPMENT USING THE SAME
Document Type and Number:
Japanese Patent JP2023151994
Kind Code:
A
Abstract:
To achieve: a diamine for forming a polyimide film capable of being suitably used for a next generation communication equipment in which frequencies are heightening or and a radar and the like; a composition containing the diamine for forming a low dielectric constant resin; a polyamic acid using the diamine; and a polyimide film.SOLUTION: A composition for forming a low dielectric constant resin is a composition containing a compound having amino groups on both terminals as shown by formula (1). A dielectric constant of a cured product obtained by curing the composition without addition of any filler at 10 GHz is lower than 3.0. For example, each of A1, A2, and A3 is 1,4-cyclohexylene,1,4-cyclohexenylene, or 1,4-phenylene. At least one of A1 and A2 is 1,4-cyclohexenylene, each of Z1, Z2, Z3, and Z4 is a single bond or a 1-20C alkylene, and m1 is 0, 1, or 2.SELECTED DRAWING: Figure 1
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Inventors:
FUJIWARA TAKESHI
SAGO KOKI
TAKATA AKIHIRO
SAGO KOKI
TAKATA AKIHIRO
Application Number:
JP2022061903A
Publication Date:
October 16, 2023
Filing Date:
April 01, 2022
Export Citation:
Assignee:
JNC CORP
International Classes:
C08G73/10; C08K3/013; C08L79/08