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Title:
ダイヤモンド超硬複合材料
Document Type and Number:
Japanese Patent JP6721615
Kind Code:
B2
Abstract:
In composite materials containing diamond particles dispersed within cemented carbide, it is difficult to simply increase the size of the diamond particles and further improve the grinding force, while preserving the grindability and wear resistance. Provided is a diamond carbide composite material in which, in place of conventional diamond particles, a diamond aggregate is dispersed into a cemented carbide structure that includes an iron group metal having WC as the primary component and containing P. The diamond aggregate: contains, as nuclei, cemented carbide in which tungsten carbide (WC) is the primary component; employs as a binder an iron group metal having WC as the primary component and containing phosphorus (P); and has diamond particles anchored to the diamond aggregate so as to cover the surfaces of the cemented carbide nuclei.

Inventors:
Kuribayashi Shingo
Kazuaki Komatsubara
Ryo Kubota
Kayoko Yanase
Application Number:
JP2017563423A
Publication Date:
July 15, 2020
Filing Date:
January 26, 2016
Export Citation:
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Assignee:
Tix Co., Ltd.
International Classes:
C22C26/00; B22F1/00; B22F1/02; B22F3/14; C22C1/05
Domestic Patent References:
JP2011001565A
JP5076044B2
JP61091344A
JP9194978A
Attorney, Agent or Firm:
Asamura patent office