Title:
DIAMOND DIE
Document Type and Number:
Japanese Patent JP2014161910
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a diamond die capable of high-quality wire drawing processing, by effectively preventing an increase and disconnection of a resistance in wire drawing processing.SOLUTION: In the diamond die, a hole for executing the wire drawing processing of a metal wire is provided in diamond, and the diamond uses gaseous phase synthetic diamond, and a shape of the hole has a reduction part, a bearing part and a back relief part toward the downstream side from the upstream side of a flow of wire drawing, and an opening angle of the reduction part is 10°-14°, and the length of the bearing part to a diameter D of a bearing is 0.2D-0.4D, and an opening angle of the back relief part is 10°-20°. This diamond die is used by setting the area reduction ratio to 8%-25% when executing the wire drawing processing.
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Inventors:
YUGAWA MINORU
FUTAGAMI SHINJI
SHIGA TOSHINORI
SUEMITSU FUMIYA
FUTAGAMI SHINJI
SHIGA TOSHINORI
SUEMITSU FUMIYA
Application Number:
JP2013038311A
Publication Date:
September 08, 2014
Filing Date:
February 28, 2013
Export Citation:
Assignee:
ALLIED MATERIAL CORP
International Classes:
B21C3/02
Domestic Patent References:
| JPH07171613A | 1995-07-11 | |||
| JPH04127913A | 1992-04-28 | |||
| JP2002102917A | 2002-04-09 |