Title:
振動板組立体の製造方法およびコンデンサマイクロホン
Document Type and Number:
Japanese Patent JP4659519
Kind Code:
B2
Abstract:
A diaphragm assembly used for a condenser microphone has a diaphragm made of a resin film including a metallized film on one surface of a supporter ring. The diaphragm is made by a first step of bonding a ring jig of a larger diameter than the supporter ring to the resin film having the metallized film composed of a ductile metallic material on the one surface via an adhesive without exerting tension on the resin film; a second step of heating and contracting the resin film bonded to the ring jig without applying the tension at a temperature over a glass transition point of a film material; and a third step of bonding the supporter ring to the resin film via an adhesive in a state of exerting predetermined tension on the resin film. The diaphragm assembly is cut out of the resin film after the adhesive becomes hardened.
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Inventors:
Hiroshi Akino
Application Number:
JP2005151930A
Publication Date:
March 30, 2011
Filing Date:
May 25, 2005
Export Citation:
Assignee:
Audio Technica Co., Ltd.
International Classes:
H04R19/04; H04R31/00
Domestic Patent References:
| JP1018897U | ||||
| JP2003199196A | ||||
| JP2001313999A | ||||
| JP2004343377A | ||||
| JP11155191A | ||||
| JP63217800A | ||||
| JP2002192614A | ||||
| JP2003025434A | ||||
| JP2000054558A | ||||
| JP55096799A | ||||
| JP2002026007A | ||||
| JP2002518923A |
Attorney, Agent or Firm:
Takuya Ohara