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Title:
DIAPHRAGM STRUCTURE
Document Type and Number:
Japanese Patent JP3439570
Kind Code:
B2
Abstract:

PURPOSE: To decrease the surface area of a non-diaphragm part and improve the sensitivity while maintaining the stiffness of a substrate and the shape of a diaphragm by joining only partly a ceramic lamination interface at the root of the diaphragm in a cavity part.
CONSTITUTION: Excimer laser is applied to the outer-periphery region of a root part 3d of a screening wall 3a of a window part 3b of a substrate where a substrate (ceramic green sheet) 2 is laminated, and an outer-periphery region (gap region) 5 of the window part 3b, and the binder on the surface of an adhesion layer is decomposed and removed to destroying the effect for assisting a lamination baking integration, thus leaving only a part where laser is applied as an unintegrated region when forming an integrated diaphragm structure 1 by laminating and baking the substrates 2-3. Therefore, the thickness of the screening wall 3a can be made thick without reducing the surface area of the operation part, hence increasing the stiffness of the substrate 3, preventing distortion and burr of the screening wall 3a from occurring at the time of punching, and further preventing the screening wall 3a from being crushed due to force to be applied to a semi-completed product at the time of manufacturing the structure 1.


Inventors:
Yukihisa Takeuchi
Keizo Miyata
Takao Ohnishi
Nobuo Takahashi
Application Number:
JP10973995A
Publication Date:
August 25, 2003
Filing Date:
May 08, 1995
Export Citation:
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Assignee:
Nippon Insulator Co., Ltd.
International Classes:
G01L7/08; G01L9/00; G01L9/04; H01L41/09; (IPC1-7): G01L9/04; G01L7/08
Domestic Patent References:
JP63292032A
Other References:
【文献】欧州特許出願公開640481(EP,A1)
Attorney, Agent or Firm:
Ippei Watanabe