Title:
DICING DEVICE AND METHOD
Document Type and Number:
Japanese Patent JP2020155429
Kind Code:
A
Abstract:
To form cutting from the rear face of a wafer at the same position as cutting which has been already formed on the surface side of the wafer.SOLUTION: According to an output of a photoelectronic sensor under a state where an optical path of spot light 131 emitted from a floodlight 105 passes above a wafer retaining surface in parallel to a wafer retaining surface of a retaining table 101 and in a direction parallel to a cutting direction, a determination section 107 determines whether or not an optical receiver 106 has received light without the spot light 131 emitted from floodlight 105 being interrupted.SELECTED DRAWING: Figure 1A
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Inventors:
TAKAMOTO YUSUKE
Application Number:
JP2019049377A
Publication Date:
September 24, 2020
Filing Date:
March 18, 2019
Export Citation:
Assignee:
AZBIL CORP
International Classes:
H01L21/301; B24B27/06; B24B47/22; B24B49/12
Attorney, Agent or Firm:
Shigeki Yamakawa
Masaki Yamakawa
Masaki Yamakawa