Title:
Dicing sheet
Document Type and Number:
Japanese Patent JP6087122
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a dicing sheet which is excellent in adhesiveness, hardly causes a pickup failure, and suppresses falling-off of a chip.SOLUTION: The dicing sheet includes a substrate 2 and an adhesive layer 3 laminated on at least one surface of the substrate 2. The adhesive layer 3 is formed of an adhesive composition containing a polymer (A), an energy ray-polymerizable compound (B), and a tackifying resin (C). The energy ray-polymerizable compound (B) has an energy ray-polymerizable group in an amount of 3×10to 5×10mol/g inclusive. The tackifying resin (C) contains a hydrogenated resin. Preferably, the tackifying resin (C) consists of the hydrogenated resin.
Inventors:
Takuo Nishida
Kanai Michio
Kanai Michio
Application Number:
JP2012264954A
Publication Date:
March 01, 2017
Filing Date:
December 04, 2012
Export Citation:
Assignee:
LINTEC CORPORATION
International Classes:
H01L21/301; C09J4/06; C09J7/02; C09J133/00; C09J201/00
Domestic Patent References:
| JP2007291147A | ||||
| JP2001226647A | ||||
| JP2003092273A | ||||
| JP2011181899A | ||||
| JP2004217793A |
Attorney, Agent or Firm:
Yuji Hayakawa
Katsuyuki Okubo
Keisuke Murasame
Katsuyuki Okubo
Keisuke Murasame