Title:
押出成形用のダイス組付工具
Document Type and Number:
Japanese Patent JP5149517
Kind Code:
B2
Abstract:
A die assembly P1 is configured such that an extrusion die 10 is mounted in a die mounting hole 61 formed in a die mounting plate 60 and a metallic material introduced in the die mounting hole 61 is introduced in the extrusion die 10 via a porthole 24 formed in a metallic material pressure receiving surface 22 of the die 10. A material accumulating portion 70 extending to a point on a more extrusion directional downstream side than an inlet position of the porthole 24 is provided outside the porthole 24 in the die mounting hole 61 to accumulate a part 75 of the metallic material introduced into the die mounting hole 61.
Inventors:
Hiramoto Koju
Hidekazu Sakihama
Hidekazu Sakihama
Application Number:
JP2007057263A
Publication Date:
February 20, 2013
Filing Date:
March 07, 2007
Export Citation:
Assignee:
SHOWA DENKO K.K.
International Classes:
B21C25/02; B21C23/08
Domestic Patent References:
| JP2004306124A | ||||
| JP49046707B1 | ||||
| JP53102938U |
Attorney, Agent or Firm:
Hisayoshi Shimizu
Ken Takada
Yoshihito Shimizu
Ken Takada
Yoshihito Shimizu