Title:
DIE ATTACHMENT PASTE AND SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP3765731
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a die attachment paste for semiconductor adhesion which has a superior solder cracking resistance.
SOLUTION: This die attachment paste consists essentially of (A) hydrocarbon having at least one double bond in one molecule of 500 to 5,000 in number mean molecular weight, (B) a compound which has at least one methacryl group or acryl group in one molecule, (C) a radical polymerizing catalyst, and (D) a filler.
Inventors:
Nobuki Tanaka
Mitsuru Okubo
Ryuichi Murayama
Ichito
Kagimoto Yasuhiro
Mitsuru Okubo
Ryuichi Murayama
Ichito
Kagimoto Yasuhiro
Application Number:
JP2001082127A
Publication Date:
April 12, 2006
Filing Date:
March 22, 2001
Export Citation:
Assignee:
Sumitomo Bakelite Co., Ltd.
International Classes:
C08K3/08; H01L21/52; C08F290/00; C08K5/12; C08K5/16; C08K5/5419; C08L15/00; C09J4/06; C09J9/02; C09J163/00; (IPC1-7): H01L21/52; C08F290/00; C08K3/08; C08K5/12; C08K5/16; C08K5/5419; C08L15/00; C09J4/06; C09J9/02; C09J163/00
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