Title:
DIE BOND MATERIAL FOR OPTICAL SEMICONDUCTOR AND OPTICAL SEMICONDUCTOR USING THE SAME
Document Type and Number:
Japanese Patent JP2012072207
Kind Code:
A
Abstract:
To provide a die bond material for an optical semiconductor, in which the production amount of a volatile content is reduced and thereby contamination by the volatile component in the periphery can be suppressed.
The die bond material for the optical semiconductor contains a first silicone resin having a hydrogen atom bonded to a silicon atom, a second silicone resin having no hydrogen atom bonded to a silicon atom and having an alkenyl group, a catalyst for a hydrosilylation reaction, and porous silica. The porous silica has a specific surface area of 150 m2/g or more, a pore volume of 0.1 mL/g or more, a pore diameter of 0.5 nm or more and 10 nm or less.
Inventors:
NISHIMURA TAKASHI
WATANABE TAKASHI
WATANABE TAKASHI
Application Number:
JP2010216026A
Publication Date:
April 12, 2012
Filing Date:
September 27, 2010
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD
International Classes:
C08L83/05; C08K3/36; C08L83/07; H01L33/48
Attorney, Agent or Firm:
宮▲崎▼ 主税
Table of contents Makoto
Tomoyuki Ishimura
Kazutoshi Nakayama
Table of contents Makoto
Tomoyuki Ishimura
Kazutoshi Nakayama