Title:
DIE-BONDING MATERIAL FOR OPTICAL SEMICONDUCTOR DEVICE AND OPTICAL SEMICONDUCTOR DEVICE USING THE SAME
Document Type and Number:
Japanese Patent JP2012074416
Kind Code:
A
Abstract:
To provide a die-bonding material for optical semiconductor device which has high heat dissipation and high reflectance of light, and is harder to be discolored into yellow even if exposed to high temperature.
The die-bonding material for optical semiconductor device contains a first silicon resin having a hydrogen atom bonded to a silicon atom, a second silicon resin not having a hydrogen atom bonded to a silicon atom but having an alkenyl group, a catalyst for hydrosilylation reaction, and titanium oxide. The titanium oxide is a rutile type titanium oxide. Thermal conductivity of titanium oxide is 10 W/mK or higher. The titanium oxide is coated with at least one of metal oxides and metal hydroxides.
Inventors:
NISHIMURA TAKASHI
WATANABE TAKASHI
WATANABE TAKASHI
Application Number:
JP2010216025A
Publication Date:
April 12, 2012
Filing Date:
September 27, 2010
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD
International Classes:
H01L21/52; C08K9/02; C08L83/05; C08L83/07
Domestic Patent References:
| JPS61278580A | 1986-12-09 | |||
| JP2009256400A | 2009-11-05 | |||
| JP2010089493A | 2010-04-22 | |||
| JP2009129801A | 2009-06-11 | |||
| JP2008520803A | 2008-06-19 |
Foreign References:
| WO2008069059A1 | 2008-06-12 |
Attorney, Agent or Firm:
宮▲崎▼ 主税
Table of contents Makoto
Tomoyuki Ishimura
Kazutoshi Nakayama
Table of contents Makoto
Tomoyuki Ishimura
Kazutoshi Nakayama