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Patent Searching and Data


Title:
DIE DEVICE
Document Type and Number:
Japanese Patent JP2004034149
Kind Code:
A
Abstract:

To provide a die device which does not bring about cracks or splits into a squeeze ring and makes the squeeze ring work for a semipermanently super-long time and perform firmly the caulking together with the laminating of punched pieces, in the die device that extracts punched pieces in an external shape by blanking and is provided with the squeeze ring that performs the caulking and laminating of the punched pieces.

In the die device in which a punch 24 is made to move into a die 25 or move back from it so that a punched piece 20 is extracted in the external shape by blanking and is put into a squeeze ring 26 provided next to the die 25 and is caulked and laminated, a protrusion 27, in which a convex top surface takes the shape of a straight surface and a corner part changing from convex to concave and a corner part changing from concave to convex are angular, is formed in the direction that crosses perpendicularly to the direction that the punched piece 20 is extracted, in the surface of an internal diameter of the squeeze ring 26.


Inventors:
FUJITA KATSUFUSA
Application Number:
JP2002198840A
Publication Date:
February 05, 2004
Filing Date:
July 08, 2002
Export Citation:
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Assignee:
MITSUI HIGH TEC
International Classes:
B21D28/02; (IPC1-7): B21D28/02