To provide a die for piece cutting capable of realizing piece cutting with high reliability and productivity without causing breakage and damage to a semiconductor device in a piece cutting process, and to provide the manufacturing method of the semiconductor device.

This die for piece cutting is provided with a knock-out 4 provided in a die block 3 vertically slidably, which is configured to push up the semiconductor device 7 remaining on the die block 3 as each piece after piece cutting upward above the upper surface of the die block 3, a push-up plate 5 positioned below the knock-out 4 to support it while being connected to it mechanically, which is configured to forcibly move the knock-out 4 vertically by its own vertical movement, and a knock-out forcibly lowering means 6 configured to forcibly draw back the push-up plate 5 downward.