Title:
DIE PUNCH FOR BENDING LEAD FRAME
Document Type and Number:
Japanese Patent JPH10326854
Kind Code:
A
Abstract:
To prevent a plating from being adhering to a die punch for bending when a solder-plated lead frame is subject to bending, and to improve moulding accuracy and production efficiency.
A die punch for bending separately consists of a base material 6, including a contact surface and a die body 21 made of conductor, and the base material 6 is made of a hard metal with a thermal expansion coefficient of 5.5×10-6 or lower. A heat treatment is applied to its surface to generate semispherical deposits made mainly of binding phase metal, and then a diamond or diamond-like carbon film is formed on the surface by the vapor phase synthesizing method, and the surface roughness of the film is finished to 0.08 μmRa or lower to prepare a contact surface.
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Inventors:
MATSUMOTO YASUSHI
KAWAI SHIGEYOSHI
NISHIMURA KAZUHITO
TOMIMORI HIROSHI
KAWAI SHIGEYOSHI
NISHIMURA KAZUHITO
TOMIMORI HIROSHI
Application Number:
JP9098598A
Publication Date:
December 08, 1998
Filing Date:
March 18, 1998
Export Citation:
Assignee:
OSAKA DIAMOND IND
International Classes:
B21D11/00; B21D5/01; B21D37/01; B21D37/20; H01L23/50; (IPC1-7): H01L23/50; B21D5/01; B21D11/00
Attorney, Agent or Firm:
Hidemi Aoki (1 outside)