To provide a die for wiredrawing capable of preventing wire surface roughness while making an improvement of the die's life and cost performance of the die compatible, and to provide a method for manufacturing a metal wire capable of inexpensively and positively realizing a steel wire having 3,200 MPa or more of tensile strength.

In the die 1 for wiredrawing made by sintering a hard material powder having either one or two or more of carbide, nitride, and carbonitride and a soft material metal binder powder, only the approach portion 3b of the chip 3 constituting the peripheral wall of the die hole and only the mouth portion 3a, or only the approach portion 3b or only the vicinity of the region which the upper most surface layer of the wire of the approach portion 3b contacts first are made of diamond.