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Title:
基体を製造するためのダイおよびダイの製造方法
Document Type and Number:
Japanese Patent JP2011513079
Kind Code:
A
Abstract:
Extrusion dies for manufacturing substrates with peripheral strengthening are manufactured by plunge EDM machining a solid material and subsequently forming slots by wire EDM slot machining.

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Inventors:
Former, David W
Humphrey, Mark Elle
Sailor, Shayne Dee
Application Number:
JP2010548722A
Publication Date:
April 28, 2011
Filing Date:
February 25, 2009
Export Citation:
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Assignee:
CORNING INCORPORATED
International Classes:
B23H1/00; B23H7/02; B29C48/07; B29C48/08; B29C48/32
Domestic Patent References:
JP2003094415A2003-04-03
JPS6328523A1988-02-06
JPH02292128A1990-12-03
Attorney, Agent or Firm:
Yanagita Seiji
Go Sakuma



 
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