ディップ成形用組成物およびディップ成形品

Title:

ディップ成形用組成物およびディップ成形品

Document Type and Number:

Japanese Patent JP5380839

Kind Code:

B2

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Inventors:

Aida Misa
Osamu Ishizu
Kuki Ota

Application Number:

JP2007533260A

Publication Date:

January 08, 2014

Filing Date:

August 29, 2006

Export Citation:

Assignee:

Zeon Corporation

International Classes:

C08F236/10; B05D1/18; C08J5/02; C08K3/22; C08L9/06; C08L13/00

Domestic Patent References:

Attorney, Agent or Firm:

Maeda/Suzuki International Patent Corporation

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