Title:
DIRECT CHIP AFFIXING MODULE
Document Type and Number:
Japanese Patent JP2804443
Kind Code:
B2
Abstract:
PURPOSE: To provide a method for fixing an electronic component onto a printed circuit board.
CONSTITUTION: The direct chip affixing module DCAM 10 comprises one or a plurality of electronic components 30 bonded to a printed circuit on a substrate. The DCAM is bonded to an electronic circuit assembly through contact pads 50 formed on the fringe of a DCAM board. Consequently, solder bonding between the DCAM and the assembly can be visually inspected easily. The DCAM board 70 is provided in the form of a panel and vias 50 are drilled at specified contact points and plated. Subsequently, the DCAM is cut off from the panel and the cut vias provide contact pads 50 on the fringe of a subboard.
Inventors:
Alan Peter Downey
Peter Galagee
John Joseph Garrity
Brian Leslie Robertson
Peter Galagee
John Joseph Garrity
Brian Leslie Robertson
Application Number:
JP22972094A
Publication Date:
September 24, 1998
Filing Date:
September 26, 1994
Export Citation:
Assignee:
International Business Machines Corporation
International Classes:
H05K1/11; H01L25/04; H01L25/18; H05K1/14; H05K3/40; H05K3/00; H05K3/34; H05K3/36; H05K3/42; (IPC1-7): H01L25/04; H01L25/18; H05K1/14
Domestic Patent References:
| JP3163861A | ||||
| JP60227492A | ||||
| JP61162056U | ||||
| JP449594Y1 |
Attorney, Agent or Firm:
Kiyoshi Goda (2 outside)
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