Title:
直接金属化プロセス
Document Type and Number:
Japanese Patent JP2011530807
Kind Code:
A
Abstract:
An improved method of providing a carbon dispersion coating on surfaces of a substrate in a direct metallization process, wherein the substrate comprises conductive and non-conductive portions. The method comprises the steps of contacting the substrate with the carbon dispersion to coat the substrate with the carbon-containing dispersion and at least one of moving a non-absorbent roller over at least a portion of a substantially planar surface of the substrate to remove excess carbon dispersion from the substantially planar surface of the substrate and passing the substrate through a vacuum extraction chamber to extract excess carbon dispersion remaining on surfaces of the substrate. The method provides cleaner copper surfaces to minimize the microetch requirement and also prevents the carbon dispersion from undesirably redepositing on surfaces of the substrate.
Inventors:
Richard Sea Letteric
Werner Lau
Joseph Schuster
Werner Lau
Joseph Schuster
Application Number:
JP2011522079A
Publication Date:
December 22, 2011
Filing Date:
June 08, 2009
Export Citation:
Assignee:
MACDERMID,INCORPORATED
International Classes:
H05K3/18; C25D5/56; C25D7/00; H05K3/42
Domestic Patent References:
| JP2002093747A | 2002-03-29 | |||
| JP2003124611A | 2003-04-25 | |||
| JP2006193332A | 2006-07-27 | |||
| JPH03207890A | 1991-09-11 | |||
| JPH11512842A | 1999-11-02 | |||
| JP2008516088A | 2008-05-15 |
Attorney, Agent or Firm:
Koichi Hirota
Yoshihiro Nagare
Naoko Matsuda
Yoshihiro Nagare
Naoko Matsuda