Title:
HIGH-SPEED ELECTROPLATING TESTER
Document Type and Number:
Japanese Patent JP3185191
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a high-speed electroplating tester by which a high-speed electroplating state is reproduced by the use of this small-sized relatively simple tester.
SOLUTION: This tester is provided with a water tank 1 with an inclined part 2a formed at the bottom face 2, an anodic metallic plate 5 provided on the inclined part 2a, a cathodic metal rod 6 rotatably held by a motor 8 along the side face 3 of the tank opposed to the anodic metallic plate 5, a cathodic metallic plate 7 wound on the periphery of the lower part of the cathodic metal rod 6 and a rectifier 9 connected to the anodic metallic plate 5 and cathodic metal rod 6.
Inventors:
Tatsuo Yamamoto
Application Number:
JP33145497A
Publication Date:
July 09, 2001
Filing Date:
December 02, 1997
Export Citation:
Assignee:
Yamamoto Plating Tester Co., Ltd.
International Classes:
C25D5/08; C25D17/00; C25D17/02; C25D21/10; C25D21/12; (IPC1-7): C25D21/12; C25D5/08; C25D17/02; C25D21/10
Domestic Patent References:
| JP4232848A |
Attorney, Agent or Firm:
Michizo Isono
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