To safely attach an IC tag to a dish body by using strength of thermosetting resin for protection of the IC tag that is attached to a dish made of the thermosetting resin.

The dish is formed of the thermosetting resin by compression molding. The dish includes a dish body 1 having an outer wall part 2 and an inner wall part 3, and the IC tag 6 embedded between the outer wall part 2 and the inner wall part 3. The IC tag 6 is fixedly arranged in a holding function part 4 formed on a joined surface between the outer wall part 2 and the inner wall part 3. The IC tag 6 is embedded and positioned accurately so that the IC tag 6 is effectively protected by the strength of the thermosetting resin.