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Title:
DISPERSER FOR FORMATION OF COAT FILM
Document Type and Number:
Japanese Patent JPH0246730
Kind Code:
A
Abstract:

PURPOSE: To provide a dispenser capable of applying liquid on a semiconductor substrate stably without causing ununiformity in thickness of an applied film and without contaminating the substrate by providing altogether in a single block body a nozzle for dropping liquid to be applied, and discharge ports for supplying a solvent for the liquid and for supplying air both for cleaning the nozzle, these components being provided integrally so as to communicate with a solvent reservoir within the block body.

CONSTITUTION: A dispenser body is formed into a block 9 having a nozzle 3. Small- diameter holes 20 are opened through the opposite sides of the nozzle 3, and a solvent supplying tube 5 and an air supplying tube 19 are attached to both ends of each of these holes, respectively. Further, a hole having a larger diameter than the holes 20 is formed on the face of the block 9 orthogonal to the faces having these tubes 5, 19, and one end of the hole defines a solvent discharging port 6 while the other end is connected with a silica liquid supplying tube 4. A discharge pipe 21 for dropping silica liquid is inserted into the solvent discharging port 6 such that one end of the discharge pipe 21 communicates with a hole of a coupling 7b of the silica liquid supplying tube 4 and a discharge port 1 for dropping the silica solution is placed slightly back from the solvent discharging port 1.


Inventors:
IWAMI RON
Application Number:
JP19832188A
Publication Date:
February 16, 1990
Filing Date:
August 08, 1988
Export Citation:
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Assignee:
NEC CORP
International Classes:
B65H3/48; B05C5/00; B05D1/26; H01L21/027; H01L21/30; H01L21/31; H01L21/316; H01L21/52; (IPC1-7): B05C5/00; B05D1/26; B65H3/48; H01L21/027; H01L21/31; H01L21/52
Domestic Patent References:
JPS61167646U1986-10-17
JPS5946164A1984-03-15
JPS56149444U1981-11-10
JPS5081067A1975-07-01
Attorney, Agent or Firm:
Naoki Kyomoto (2 outside)



 
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