Title:
表示装置及びその製造方法
Document Type and Number:
Japanese Patent JP6580808
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a manufacturing method for support substrate polyimide film used for manufacturing an organic EL device that can be thin, light-weight, and flexible, does not cause cracks and detachment due to thermal stress and is excellent in dimensional stability.SOLUTION: The manufacturing method for display device support substrate polyimide film includes: applying resin solution of polyimide or polyimide precursor on a base substrate so that the polyimide film has a thickness of 50 μm or less; completing heat treatment and forming the polyimide film on the base substrate; and separating the polyimide film from the base substrate. The polyimide film has a transmissivity of 80% or more in a wavelength region of 440 nm to 780 nm and a transmissivity of 80% or less in 400 nm. The display device support substrate polyimide film is manufactured by irradiating a bottom face of the polyimide film with a laser beam through the base substrate to separate the polyimide film from the base substrate.SELECTED DRAWING: None
Inventors:
Masakazu Katayama
Katsufumi Hiraishi
Natsuko Okazaki
Yoshiki Sudo
Wang Hongyuan
Katsufumi Hiraishi
Natsuko Okazaki
Yoshiki Sudo
Wang Hongyuan
Application Number:
JP2013128628A
Publication Date:
September 25, 2019
Filing Date:
June 19, 2013
Export Citation:
Assignee:
Nippon Steel Chemical & Material Co., Ltd.
International Classes:
H05B33/02; B32B27/34; G02B5/20; G09F9/30; H01L27/32; H01L51/50; H05B33/04; H05B33/12
Domestic Patent References:
| JP2006255918A | ||||
| JP2011227369A | ||||
| JP2008256736A | ||||
| JP2003260750A | ||||
| JP2012102155A | ||||
| JP2012109255A | ||||
| JP2012000546A | ||||
| JP4328524A | ||||
| JP2011031429A | ||||
| JP2003280550A | ||||
| JP2011227205A | ||||
| JP2008297360A | ||||
| JP2008231327A |
Attorney, Agent or Firm:
Kazuya Sasaki
Eiichi Sano
Katsumi Hara
Shuji Hisamoto
Katsuo Naruse
Eiichi Sano
Katsumi Hara
Shuji Hisamoto
Katsuo Naruse