To provide a compact display device whose manufacturing cost is low, and whose heat dissipation is excellent, and to provide a method for forming the protecting member of its light emitting element.
Plural LEDs 10 are arrayed on a printed circuit board 3. Each LED 10 is provided with a light emitting part 12 and an electrode part 11, and fixed through the electrode part 11 to the printed circuit board 3. Then, liquid-shaped resin is supplied to the face of the arrayed side of the LED 10 of the printed circuit board 3 so that a resin layer 14 with prescribed thickness can be formed, and then a spacer 5 is overlapped on the resin layer 14. The spacer 5 is provided with a through-hole 50 formed corresponding to the arrayed positions of the LED 10 on the printed circuit board 3, and, when the spacer 5 is overlapped on the resin layer 14, each LED 10 is inserted into the through-holes 50 of the spacer 5. According as the spacer 5 is deepened into the resin layer 14, one part of the resin is allowed to flow into the through-holes 50, and packed in the surrounding of the electrode parts 11 of the LED 10. Then, the resin layer 14 is hardened, and the spacer 5 is pulled out of the resin layer 14 so that the electrode parts 11 of the LED 10 can be covered, and a protecting member 15 having prescribed intervals can be obtained.
NAKAGAWA HIDEAKI