Title:
両頭平面研削盤
Document Type and Number:
Japanese Patent JP4818995
Kind Code:
B2
Inventors:
Toshiharu Morito
Application Number:
JP2007165963A
Publication Date:
November 16, 2011
Filing Date:
June 25, 2007
Export Citation:
Assignee:
Daisho Seiki Co., Ltd.
International Classes:
B24B7/17
Domestic Patent References:
JP63158754U | ||||
JP7186020A | ||||
JP1310852A | ||||
JP11245149A | ||||
JP59097831A | ||||
JP2002355750A | ||||
JP2000218532A | ||||
JP2002370161A |
Attorney, Agent or Firm:
Mitsuo Tanaka
Aoyama Aoi
Yasushi Ohata
Aoyama Aoi
Yasushi Ohata