Title:
半導体ウェーハの両面研磨方法、研磨ウェーハの製造方法、及び半導体ウェーハの両面研磨装置
Document Type and Number:
Japanese Patent JP7464088
Kind Code:
B2
Inventors:
Ryo Kuramoto
Yuji Miyazaki
Taiki Goto
Yuji Miyazaki
Taiki Goto
Application Number:
JP2022138647A
Publication Date:
April 09, 2024
Filing Date:
August 31, 2022
Export Citation:
Assignee:
Sumco inc.
International Classes:
H01L21/304; B24B37/08; B24B37/28; B24B55/06; B24B57/02
Domestic Patent References:
| JP2004142040A | ||||
| JP2002016025A | ||||
| JP2001246554A | ||||
| JP2018012166A | ||||
| JP2022097206A |
Foreign References:
| WO2019043895A1 | ||||
| WO2005055302A1 |
Attorney, Agent or Firm:
Kenji Sugimura
Mitsutsugu Sugimura
Keisuke Kawahara
Yusuke Yamaguchi
Mitsutsugu Sugimura
Keisuke Kawahara
Yusuke Yamaguchi