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Patent Searching and Data


Title:
DRAWING APPARATUS AND DRAWING METHOD
Document Type and Number:
Japanese Patent JP2008242218
Kind Code:
A
Abstract:

To highly accurately detect a placing position and a placing attitude of a substrate on a drawing stage and to high-accuracy drawing patterns at predetermined positions, on both the surfaces of the substrate.

Contour parts 98a to 98d of one surface of the substrate F mounted on an exposure stage 18 are photographed by CCD cameras 22a to 22d, the placing position and placing posture of the substrate F are calculated, drawing data are corrected; and after exposing and recording a pattern on the basis of the corrected drawing data, the substrate F is inverted and drawing data are similarly exposed and recorded on the other surface.


Inventors:
KIKUCHI HIROAKI
MATAMA TORU
FUJII TAKESHI
SAWANO MITSURU
Application Number:
JP2007084488A
Publication Date:
October 09, 2008
Filing Date:
March 28, 2007
Export Citation:
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Assignee:
FUJIFILM CORP
International Classes:
G03F7/20
Domestic Patent References:
JPH11307425A1999-11-05
JPH11337314A1999-12-10
JP2003282427A2003-10-03
JP2004317204A2004-11-11
JP2004343066A2004-12-02
JP2004356411A2004-12-16
JP2006259202A2006-09-28
JP2006259715A2006-09-28
JP2004356414A2004-12-16
JP2002181513A2002-06-26
Attorney, Agent or Firm:
Takehiro Chiba
Toshiyuki Miyadera
Naoki Kashima
Yasuo Takubo